Ekem’s new products in SFCHINA2009 received wide-spread recognition
From November 11, 2009 to November 17, 2009, Academic Exchange of China Electronic Plating and Surface Finishing and Celebration on the 30th Anniversary of the Founding of Electronic Plating Special Committee of China Electronics Association was held in Fudan University. This conference was hosted jointly by Electroplating Expert Committee of the Branch of Electronics Manufacturing and Encapsulation Technology of Chinese Institute of Electronic, and Electronic Plating Expert Committee of Shanghai Institute of Electronics.
The conference invited some famous experts and scholars home and abroad in the field of electronic plating, giving special academic report on its latest research. The conference received wide attention and was covered by professional media such as PCB China Net, Electroplating& Finishing, Materials Protection, and HC Network.
Ye Jindui, president of Ekem and vice-director member of China Electronic Plating Expert Committee, was invited to the conference and presided some important sessions.
This conference helped participants to get a better understanding of the latest development and researches in the industry. It also provided a larger cooperation platform for colleges, associations and enterprises, pushing forward the rapid development of electronic plating industry.